ADLINK Technology CoreModule 730 Instrukcja Użytkownika Pobierz pdf (Strona 7)

MiniModule SIO Reference Manual 3

Chapter 2 Product Overview

This introduction presents general information about Stackable architecture and the MiniModule SIO

expansion board. After reading this chapter you should understand:

• Stackable Architecture

• MiniModule SIO Features

• MiniModule SIO Product Description

• MiniModule SIO Major Components and Headers

• MiniModule SIO Specifications

Stackable Architecture

Stackable architecture affords a great deal of flexibility in system expansion. The SUMIT interface allows

you to add legacy I/O to a legacy-free CoreModule board by simply stacking an ADLINK MiniModule SIO

board onto the CoreModule SUMIT connectors. Expanding a simple CoreModule system by adding self-

stacking MiniModule SIOs or 3rd party PC/104 expansion boards provides functional capabilities such as:

• Analog or digital I/O (including serial, parallel, and USB 2.0)

• PCIe links

• ISA bus

PC/104 expansion modules can be stacked with the MiniModule SIO, avoiding the need for card cages and

backplanes. PC/104 expansion modules can be mounted directly to the PC/104 bus connector of the

MiniModule SIO with an inter-board spacing of ~0.60 inches so that a 3-module system fits in a 3.6 x 3.8 x

2.4 inch space. See Figure 2-1.

Figure 2-1. Stacking the MiniModule ISA with CoreModule Product

4-40 nut (4)

CoreModule

Sumit Stackthrough

0.6 inch spacer (4)

4-40 screw (4)

PC/104 Module

MiniModule SIO

1 2 3 4 5 6 7 8 9 10 11 12 ... 29 30

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ADLINK Technology CoreModule 730 Instrukcja Użytkownika Strona 7