ADLINK Technology CoreModule 730 Instrukcja Użytkownika Strona 3

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MiniModule SIO Reference Manual iii
Contents
Chapter 1 About This Manual ....................................................................................................1
Purpose ...........................................................................................................................................1
References ......................................................................................................................................1
Chapter 2 Product Overview......................................................................................................3
Stackable Architecture ....................................................................................................................3
Product Description..........................................................................................................................4
Module Features ........................................................................................................................4
Block Diagram ............................................................................................................................5
Major Integrated Circuits (ICs)....................................................................................................6
Headers, Connectors, and Sockets .................................................................................................9
Jumper Settings .......................................................................................................................12
Specifications.................................................................................................................................13
Physical Specifications ............................................................................................................13
Mechanical Specifications ........................................................................................................13
Power Specifications ................................................................................................................14
Environmental Specifications....................................................................................................14
Thermal/Cooling Requirements ................................................................................................14
Chapter 3 Hardware..................................................................................................................15
Overview ........................................................................................................................................15
MiniBlade Storage Solution............................................................................................................15
Serial Interfaces .............................................................................................................................17
Parallel (LPT) Port Interface ..........................................................................................................19
USB Interfaces ..............................................................................................................................20
I2C Bus ..........................................................................................................................................20
Keyboard/Mouse Interface.............................................................................................................20
Power In Interface..........................................................................................................................21
Battery Interface.............................................................................................................................21
LPC (Low Pin Count) Interface ......................................................................................................22
Appendix A Technical Support...................................................................................................23
Index...................................................................................................................................................25
List of Figures
Figure 2-1. Stacking the MiniModule ISA with CoreModule Product..........................................3
Figure 2-2. MiniModule SIO Block Diagram ...............................................................................5
Figure 2-3. MiniModule SIO Components (Bottom-Side View) ..................................................7
Figure 2-4. MiniModule SIO Components (Top-Side View) .......................................................8
Figure 2-5. Connector Pin Identifications .................................................................................10
Figure 2-6. Header and Connector Locations (Top-Side View) ...............................................10
Figure 2-7. Header and Connector Locations (Bottom-Side View) ..........................................11
Figure 2-8. Jumper Locations (Top-Side View)........................................................................12
Figure 2-9. Mechanical Dimensions (Top-Side View) ..............................................................13
Figure 3-1. RS-485 Serial Port Implementation .......................................................................17
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